Keynote Speakers Announced for embedded world North America 2025

Chad Cox

September 10, 2025

Introducing the CYW20822 Bluetooth Module

Embedded Computing Design Staff

September 8, 2025

Infineon’s 20822 module is the ideal turnkey solution delivering a ton of performance and power efficiency in a cost-effective package that contains everything developers will need to integrate Bluetooth into their products.

ICYMI: Embedded Insights Ep31 South America, Software Assurance, Rust, and MORE!

Ken Briodagh

September 5, 2025

Hello Embedded Engineers, Developers and Makers! Welcome to a special “In the field” In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Antenova Launches Opaca SR4L104 Antenna for T-Mobile Band 71 and Global 5G Networks

Chad Cox

September 5, 2025

Qualcomm Dragonwing Q-6690 Brings RFID, AI, and 5G to Enterprise Mobile Platforms

Chad Cox

August 28, 2025

Ditch the Dongle: Engineered for Intel Evo

Embedded Computing Design Staff

August 19, 2025

Ditch the dongle with Engineered for Intel Evo, a verified program that meets Intel’s strict direct-to-host wireless connection requirements. Powered by Infineon’s CYW20829, the first program co-engineered with Intel at the chip and SDK level, physical security is enhanced while meeting CRA and RED certifications. This innovation brings significant advancement to the wireless connectivity space, streamlining development and elevating the user experience.

ICYMI: Embedded Insights Ep28 Modules, Antennas, HPC, & AI at the Edge!

Ken Briodagh

August 8, 2025

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

embedded world North America 2025: Your Guide for Event Details, What to Expect, and Key Tips for Success

Embedded Computing Design Staff

August 8, 2025

Embedded Executive: Proper Antenna Design Can Make or Break Your Product | Taoglas

Rich Nass

August 6, 2025

ICYMI: Embedded Insights Ep26 072525 Memory IP, BLE, and AI Modules

Ken Briodagh

July 25, 2025

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

EnGenius ECS2530FP Switch Powers Wi-Fi 7, AI Surveillance, and VoIP

Chad Cox

July 23, 2025

Shelly Announces Portfolio of Shelly Wave Devices with Z-Wave Long Range

Tiera Oliver

July 22, 2025

Introducing the AIROC™️ CYW20829 Bluetooth

Embedded Computing Design Staff

July 21, 2025

Learn about the latest Bluetooth offering from Infineon in the AIROC™️ CYW20829 Bluetooth®️ LE MCU. See if it is right for your applications with the latest Bluetooth®️ LE 5.4 support, up to 2300 meters range without an external PA, ultra-low latency with an average of 1 ms sub event interval, and more.

Lattice’s New FPGAs Enable Smarter, More Secure, and Energy-Efficient Applications

Chad Cox

July 16, 2025

AIROC™️ CYW20829 Bluetooth LE MCU Long Range Capabilities"

Embedded Computing Design Staff

July 7, 2025

Listen to our application engineer and his team unveil our Bluetooth LE Long Range Capabilities and the outcomes of our extensive testing on the CYW20829 device.

OpenAI for Government & 5G Smart Manufacturing

Embedded Computing Design Staff , Embedded Insiders

June 26, 2025

ICYMI: Embedded Insights Ep22 AI, RISC-V, GSML

Ken Briodagh

June 20, 2025

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Bluetooth Audio is Changing. Here’s What You Need to Know

Embedded Computing Design Staff

June 16, 2025

LE Audio brings in a suite of changes, including a new generic audio framework and a new audio codec. The latest spec introduces ISOC channels, and at a high level, this enables lower latency between devices, bidirectional communication, and broadcasting. This broadcasting feature is a big change in LE Audio since it will enable one-to-many devices capability, whereas before Classic Audio was limited to point-to-point communication.