The Ivy Bridge GPU takes advantage of Intel’s 22nm FinFET process to nearly double performance and enhance programmability with DX11 and OpenCL 1.1 support. The new scalable architecture features more powerful shader cores, distributed sampling pipelines, a high bandwidth L3 cache, tesselation and 4K resolution displays. Overall, Ivy Bridge should be the highest performance integrated GPU at launch and Intel’s first competitive graphics offering.
Analysis of Haswell’s Transactional Memory
February 15, 2012 By
Intel’s upcoming Haswell microprocessors include transactional memory and hardware lock elision that are exposed through the Transactional Synchronization Extensions or TSX. In this article, I discuss TSX and predict the implementation details of Haswell’s transactional memory and expected adoption across the industry, based on my previous experience.
AMD’s Analyst Update
February 7, 2012 By
AMD’s new management took to the stage to highlight a new strategy and share the roadmap for 2012-2013. The executives generally came across well and there are only a few changes from the existing focus, with no major shifts. The updated server roadmap seems challenging, given the competition, but client systems should do decently and expand AMD’s footprint in mobile.
Medfield, Intel’s x86 Phone Chip
January 23, 2012 By
For 4 years, Intel has struggled to move into the market for mobile devices. Conventional wisdom holds that x86 is too inefficient for smart phones. The recently announced 32nm Medfield proves that x86 is a viable option and that Intel can design smart phone products. We explore the Medfield SoC and analyze the impact on Intel’s mobile strategy.
AMD’s Mobile Strategy
December 14, 2011 By
With all the recent changes, AMD seems like a ship adrift at sea with no clear strategy or vision. We look at AMD and where they are likely to head in the coming years for tablets and phones and explain why they will stick with x86, rather than embrace ARM as some have suggested.
ISSCC 2012 Preview
November 28, 2011 By
Highlights of the upcoming 2012 ISSCC include the first 22nm disclosures from Intel and several SoC papers from AMD, Cavium Networks and Oracle. Looking out further to the future, the clear focus is power consumption. There are several papers from Intel on low-power logic, one from IBM discussing 3D integration of embedded DRAM and a third from Fujitsu on system level power for the K supercomputer.
Nvidia’s Kal-El Goes Asymmetric
October 5, 2011 By
Nvidia’s Kal-El sports a novel 5th ‘companion’ core to lower idle power. We look at the trade-offs and benefits to this approach and explain why it will be a strong tablet SoC, but only an incremental gain for smartphones.
Llano at Hot Chips
August 31, 2011 By
AMD’s Hot Chips presentation delved into Llano, the first mainstream Fusion product, with details and results for power management. Previous disclosures painted a poor picture, which is far from the truth. Given the older CPU and GPU designs and time-to-market pressure, the results are quite good. Llano’s power management focuses on the most important aspects and is a solid foundation for future generations that will be much more power aware and optimized.
AMD Fusion Architecture and Llano
June 27, 2011 By
AMD has a grand vision for software and physical integration of CPUs and GPUs. The first Fusion generation focused on time to market, but created a solid foundation. Llano is a surprisingly attractive mid-range and value notebook product, due to the vastly enhanced power management. Future Fusion products will upgrade the CPU, GPU and media hardware and move towards a more tightly integrated computing model.
What Do Overclockers and Supercomputers Have in Common?
June 20, 2011 By
Enthusiasts and engineers know cooling is vital; it raises frequency and dramatically lowers power by reducing CPU or GPU temperatures. The world’s fastest supercomputer shows that thermal management can increase CPU performance/watt by 20% and cooling is critical for 3D integration and Moore’s Law.
