IC Package Types or Outlines

IC Package Types

The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of course, cost.

Popular IC package types used in the semiconductor industry today are presented in Table 1 below.

Table 1. Types of IC Packages (not shown in scale)

	CBGA - Ceramic Ball Grid Array
	CCGA - Ceramic Column Grid Array
	CerDIP - Ceramic Dual-in-Line Package
	CerPack - Ceramic Package
	CLCC - Ceramic Leadless Chip Carrier
	CPGA - Ceramic Pin Grid Array
	CQFP - Ceramic Quad Flat Pack
	D2PAK or DDPAK - Dou-ble Decawatt Package
	D3PAK - Decawatt Package 3
	DFN - Dual Flat No Leads Package
	DPAK - Decawatt Package
	FBGA - Fine-Pitch Ball Grid Array
	JLCC - J-Leaded Ceramic Chip Carrier
	LFBGA - Low Profile Fine-Pitch Ball Grid Array
	LGA - Land Grid Array
	LQFP - Low-Profile Quad Flat Package
	MLP - Micro Leadframe Package
	MQFP - Metric Quad Flat Package
	MSOP - Micro Small Outline Package
	PBGA - Plastic Ball Grid Array
	PDIP - Plastic Dual-in-Line Package
	PLCC - Plastic Leaded Chip Carrier
	PPGA - Plastic Pin Grid Array
	PQFN - Power Quad Flat No Leads Package

	PQFP - Plastic Quad Flat Pack
	PSOP - Power Small Outline Package
	QFN - Quad Flat No Leads Package
	QSOP - Quarter Size Outline Package
	SBDIP - Sidebraze Dual-in-Line Package
	SC-70 - Small Outline Transistor
	SIP - Single-In-Line Package
	SOIC - Small Outline IC Package
	SOJ - Small Outline J-Lead Package
	SOT-23 - Small Outline Transistor
	SPDIP - Shrink Plastic Dual-in-Line Package
	SSOP - Shrink Small Outline Package
	TDFN - Thin Dual Flat No Leads Package
	TFBGA - Thin Fine-Pitch Ball Grid Array
	TQFN - Thin Quad Flat No Leads Package
	TQFP - Thin Quad Flat Pack
	TSOP - Thin Small Outline Package
	TSSOP - Thin Shrink Small Outline Package
	UTDFN - Ultra Thin Dual Flat No Leads Package
	UTQFN - Ultra Thin Quad Flat No Leads Package
	VFBGA - Very Thin Fine-Pitch Ball Grid Array
	VSOP - Very Small Outline Package
	XDFN - Extreme Thin Dual Flat No Leads Package
	XQFN - Extreme Thin Quad Flat No Leads Package

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