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Panasonic Microcomputer concept




Product Overview

Unified microcomputer architecture delivering improved performance and cost savings

Based on a rigorous analysis of embedded device software and system needs, the Panasonic AM1 (MN101C/MN101E/MN101L) and AM3 (MN103H/MN103S/ MN103L) Series signal a new concept in microcomputer design. With 8-bit and 32-bit models that share a unified architecture, these microcomputers combine high performance with low power consumption in a package that supports C-language programming for a fast, efficient development cycle. Since the instructions for MN103H/MN103S and MN101C/MN101E are respectively compatible with MN103L's and MN101L's, the programming data can be inherited to achieve efficient system development. They feature a single development environment and are suitable for a wide range of applications, including high-performance embedded controllers and key devices in multimedia hardware.

32-bit 8-bit
Series Fast,High Performance
MN103H Series
High Performance
MN103S Series
Low Power
MN103L Series
MN101C Series
MN101E Series
Low Power
MN101L Series
Maximum Frequency 120MHz 60MHz 40MHz 20MHz 10MHz
ROM Size 32Kbyte to 1Mbyte 32Kbyte to 1Mbyte 128Kbyte to 1Mbyte 32Kbyte to 256Kbyte 16Kbyte to 128Kbyte
Applications Power Control,
Inverter Control,
etc.
Inverter Control,
System Control,
etc.
System Control,
Inverter Control,
Automobile Use,
etc.
System Control,
Inverter Control,
LCD control,
Automobile Use,
etc.
Low-Power-Consumption
System Controller, etc.

microcomputer roadmap


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Features

Low power & high efficiency

Unique ReRAM technology and ultralow voltage

Microcomputer with new non-volatile memory ReRAM developed

Panasonic has developed an industry�s first new non-volatile memory ReRAM. The 1T1R-ReRAM memory is fabricated by the CMOS process with 0.18-μm low power consumption ReRAM, enabling readout at low-voltage and fast memory cell rewriting at 10 ns.
Microcomputer with ReRAM reduces power consumption of applications, in particular allowing longer battery life and downsizing for environment infrastructure equipment, such as smart meter, and mobile devices, such as smart phone requiring low power consumption.

Detail

1T1R-ReRAM Memory Cell

1T1R-ReRAM Memory Cell


Mechanism of ReRAM Memory

ReRAM is a device capable of changing its resistance at intervals of at least 10ns and holding the value, therefore allowing high-speed rewriting.
Furthermore, it can be easily applied to fine process and has a potential leading to large memory capacity.

  Mechanism of ReRAM Memory


Comparison of ReRAM Memory and Flash Memory
Items ReRAM memory Flash memory
Operating
principles
Resistance change
by oxidation and reduction
Charge injection and ejection
by high voltage applied
Features 1.Power-saving readout
2.Rewritten in units of bytes
3.High-speed rewriting
1.Space-saving and large capacity
2.Written in units of bytes, but erased
in units of sectors

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Dedicated extended ALU

In order to control devices in real time, a dedicated extended ALU can be provided to perform a high-speed multiplication/division and multiply-and-accumulate operation. The ALU can decrease the frequency of the system clock to deliver both high performance and low power consumption.
By increasing the frequency of the system clock, you can also use our microcontrollers for power supplies or other advanced control systems.


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Low system cost

Highaccuracy Analog ICs

To achieve a high-accuracy analog function, we have used the know-how cultivated through the analog product development to develop microcontrollers.
The on-chip oscillator, voltage detection circuit, and high-precision operational amplifier allow the number of external parts to be reduced, which leads to the reduction of the system cost.


High voltage ICs

Provides high-voltage input pins to control batteries and touch panels.
Reduces the number of external parts for high voltage to enable a low-cost high-voltage system.


On-chip EEPROM

The data area of Flash memory and ReRAM can be used as an alternative for EEPROM, thus allowing external EEPROMs to be reduced.


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Easy to use

High noise immunity

The IC, as the center of control in modern electronic equipment, plays a crucial role supporting progress in this equipment. As the functionality provided by the latest electronic equipment continues to advance, even higher integration levels and even higher speeds are required in their ICs. At the same time, the popularity of portable electronic equipment has led to demands for further miniaturization and lower operating voltages. To respond to these needs and demands, IC fabrication processes have moved to ever finer feature sizes, progressing in tandem with other IC developments.
Due to these advances, IC malfunctions due to noise is becoming a significant issue, and inadequate electromagnetic compatibility (EMC: the ability to operate in the presence of noise) is now the focus of much concern.
Since EMC problems largely depend on the PCB design, until now, EMC problems have been seen as an issue for end product design, and workarounds have largely focused on the end product. However, due to the lower voltages and higher speeds of the latest equipment,it has become harder then ever to distinguish between noise and normal signals. At the same time, the increasing functionality of advanced ICs has made analyses related to EMC more difficult, and this in turn makes workarounds in the end product harder to achieve.
With today's shorter product cycles, the time and effort required to achieve the required EMC at the end product level has become a significant factor, and improved resistance to noise at the independent IC level is becoming increasingly important.



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Details of the technology

High noise immunity

The IC, as the center of control in modern electronic equipment, plays a crucial role supporting progress in this equipment. As the functionality provided by the latest electronic equipment continues to advance, even higher integration levels and even higher speeds are required in their ICs. At the same time, the popularity of portable electronic equipment has led to demands for further miniaturization and lower operating voltages. To respond to these needs and demands, IC fabrication processes have moved to ever finer feature sizes, progressing in tandem with other IC developments.
Due to these advances, IC malfunctions due to noise is becoming a significant issue, and inadequate electromagnetic compatibility (EMC: the ability to operate in the presence of noise) is now the focus of much concern.
Since EMC problems largely depend on the PCB design, until now, EMC problems have been seen as an issue for end product design, and workarounds have largely focused on the end product. However, due to the lower voltages and higher speeds of the latest equipment,it has become harder then ever to distinguish between noise and normal signals. At the same time, the increasing functionality of advanced ICs has made analyses related to EMC more difficult, and this in turn makes workarounds in the end product harder to achieve.
With today's shorter product cycles, the time and effort required to achieve the required EMC at the end product level has become a significant factor, and improved resistance to noise at the independent IC level is becoming increasingly important.

The focus of EMC workarounds is changing. As speeds and functionality increase, EMC workarounds become increasingly difficult. Thus EMC solutions at the IC (component) level are now indispensable.


EMC Standards for ICs

In Japan, EMC standards for electronic equipment as end products are regulated by a variety of laws covering electromagnetic radiation and consumer products. Radio Low, Electrical Appliance and Material Control Low, or similar laws are in force around the world, such as the IEC regulations on electronic equipment that have been in force in Europe since 1996.
In contrast, EMC standards for electronic device such as ICs are still at the stage where the IEC is working on the standardization of test procedures.
In addition to EMI measurement in conformance with IEC standards, Panasonic is also developing evaluation methods for EMS such as those described below and preparing an environment that will allow independent evaluation of ICs.

Panasonic's Original Noise Immunity Evaluation Methods

Panasonic models the noise entering an IC as being of two types: conductive noise and radiation noise, and aims at standardization with common programs and noise evaluation boards that improve observability to eliminate dependence on the user's mounting boards and software.

Panasonic's Original Noise Immunity Evaluation Methods


Technologies for reduced EMS for improved noise immunity characteristics(EMS: Electromagnetic Susceptibility)

Causes of IC Malfunctions

The ICs used in electronic equipment are subject to a wide range of noise sources. These include power supply noise, electrostatic noise (ESD), radio noise, and spark noise from high-voltage components in the vicinity. These noise signals enter the end product through power supply lines and the chassis, affect the PCBs the ICs are mounted on, and finally impinge on the ICs. The following phenomena are thought to cause IC malfunctions in this type of environment.

  1. Noise is superimposed on the input signals, the IC is unable to distinguish between noise and the actual input signals, and as a result, the IC malfunctions.
  2. Power supply level fluctuations cause internal signal levels to fluctuate and the IC to malfunction.
What is the noise that enters ICs?

What is the noise that enters ICs?


Enhancements to Noise Immunity Characteristics

Panasonic has enhanced the noise immunity of the AM microcomputers based on the following points.

  1. Improved immunity to noise superimposed on input signals: Strengthening the ability to reject noise on the oscillator, reset, and interrupt signal pins.
  2. Improved immunity to power supply fluctuations: Fabricating capacitors internally on the chip itself to both improve power supply stability and to suppress fluctuations in the power supply levels.
  3. AM microcomputer operating mode stabilization: Additional failsafe measures have been implemented to handle rare and unexpected malfunctions.
Improved resistance to power supply noise

Improved resistance to power supply noise

Capacitors are placed at critical points in the IC power supply and function blocks in the AM microcomputers. The placement of these capacitors in the IC stabilizes the power supply are and improves the IC's resistance to noise.

Improved resistance to input signal noise

Improved resistance to input signal noise

Transmission of noise superimposed on input signals to internal circuits is prevented by inserting appropriate noise filters. Furthermore, measures such as adding Schmitt trigger circuits and optimizing input sensitivities have been applied to pins, such as oscillator, reset, and interrupt pins, for which software noise countermeasures are difficult.

Improved protection functions

Improved protection functions

These microcomputers feature protection functions for operating mode transitions to prevent operating mode transitions should a software runaway occur.


Reduction of extraneous radiation using EMI suppression technology(EMI: Electromagnetic Interference)

Causes of EMI Emission in Electronic Equipment

ICs used in electronic equipment handle digital signals and generate harmonic currents. It is thought that the PCBs, wiring harnesses, and chassis in application systems act as antennas and radiate these high-frequency signals to the surrounding environment. Of these, the supply currents associated with internal logic operation show little attenuation,since these are upper harmonics of a fundamental that is the operating frequency, and as a result can easily cause problems.

EMI generation mechanisms

EMI generation mechanisms


EMI Reduction Measures

The following EMI reduction measures are implemented in the AM microcomputers.

  1. Improved decoupling capacitors: High-frequency noise leakage is suppressed by forming capacitors on the chip internal power supply lines.
  2. Current smoothing: IC internal peak currents were reduced by implementing gated clock circuits, optimizing the clock driver circuits, and other measures.
  3. Power supply isolation: Interference due to internal noise is prevented by isolating the CPU, I/O system, and analog system power supplies. Furthermore, the noise power itself is reduced by achieving both reduced power consumption and reduced EMS. In addition, it is now possible to create EMI countermeasures early in the IC design stage with EMI prediction technologies that use power supply current analysis technologies.
Improved decoupling capacitors

Improved decoupling capacitors

In the AM microcomputer series, bypasses are provided for noise currents by placing capacitors in the IC. This suppresses power supply noise leakage.

Current smoothing

Current smoothing

Low-voltage operation that achieves both reduced power consumption and reduced EMS in the AM microcomputer series reduces the power of the noise itself.

EMI prediction technology based on EDA

EMI prediction technology based on EDA

Power supply currents are calculated using single-chip simulation, and the EMI of the final product is predicted based on waveform analysis. This allows the desired EMI characteristics to be built into the product from the design stage.


Examples of Improved EMC Performance(Achievement of both high noise immunity and low EMI)

Examples of Improved Noise Immunity

Panasonic has achieved a significant improvement in noise immunity over earlier products. Despite progress in process feature sizes, Panasonic has achieved even further improvements in voltage handling capacity, and has assured better noise immunity than provided by earlier improved products, even in low-voltage process devices.

Power line noise test
Loop radiation noise test

Power line noise test, Loop radiation noise test

The DC line noise and loop radiation noise test methods were developed by Panasonic, and are based on two models, one for noise transmitted to the IC via conduction and one for noise transmitted to the IC via radiation. To eliminate dependency of the test result on the application program, these tests are standardized with a common program that improves observability and a dedicated noise evaluation board.

Examples of Reduced EMI
Earlier products (Test results using the MP method)

Earlier products (Test results using the MP method)

Improved version (Test results using the MP method)

Improved version (Test results using the MP method)

  • * The MP method is one of the IC EMI evaluation methods currently being considered by the IEC. The IC power supply current is measured using a shielded loop antenna. (IEC61967-6)

EMI measurement test for the MP method

EMI measurement test for the MP method


Integrated Development Environment

Development tool for hardware

The PanaX EX Series, an on-board debugging and programming environment for our microcontrollers, has not only the execution control, event/brake, and load functions equivalent to the existing in-circuit emulator, but also the quasi-on-the-fly function that minimizes the impact on the execution time (watch function, etc.), thus supporting the real-time debugging.
It also provides various development tools for hardware, such as in-circuit emulator and Flash programmer.


Detail


Development tool for software

Supports the development in C, and provides the C/C++ compiler that is optimized to achieve the high-level objects efficiency. The DebugFactory Builder, an integrated development environment, provides a compiler and makes you comfortable in debugging.


Detail

Support system

Panasonic Microcontroller product information is available online or through our sales office.



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Applications


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Related Products


  • * Blu-ray Disc™ and Blu-ray™ are trademarks of the Blu-ray Disc Association.

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