ANI
The Electronic Industries Association of India (ELCINA) has welcomed the Union Cabinet’s recent approval of four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), calling it a decisive step towards strengthening the country’s electronics manufacturing base and positioning India in emerging segments of the global chip industry.
Notably, with an investment outlay of nearly Rs 4,600 crore, the projects span Odisha, Punjab, and Andhra Pradesh, bringing India into advanced domains such as silicon carbide (SiC) semiconductors, high-power discrete devices, and advanced glass substrate packaging.
“These approvals represent a giant leap forward in India’s semiconductor journey,” said Sasikumar Gendham, President of ELCINA. “For the first time, we will see commercial production of compound semiconductors and advanced glass substrate packaging on Indian soil, reducing critical import dependencies. This will not only ease pressure on our electronics trade balance but also provide the backbone for strategic sectors like defence, EVs and renewable energy.”
“With India now investing in technologies that go beyond conventional silicon, we are positioning ourselves not just as participants but as potential leaders in high-growth markets such as EV charging and high-performance computing,” he said.
Gendham further stated that ELCINA looks at the approvals as part of a longer cycle of transformation. “The combination of cutting-edge technologies and strong domestic manufacturing will position India as a serious contender in the global semiconductor market. These projects also show that the government is listening to industry feedback and diversifying focus instead of chasing only the traditional silicon fab model. ELCINA will actively support their execution, facilitate industry-academia linkages, and ensure they are seamlessly integrated into our broader electronics ecosystem,” he added.
State-level strategic impact
In Andhra Pradesh, ASIP Technologies, backed by South Korea’s APACT Co. Ltd, will set up a system-in-package (SiP) unit aimed at mobile, automotive and consumer electronics. Odisha is expected to emerge as a hotspot for next-generation semiconductor technologies. SiCSem Pvt. Ltd, in collaboration with the UK’s Clas-SiC Wafer Fab, will establish India’s first SiC fab with an annual capacity of 60,000 wafers and 96 million packaged units. Additionally, US-based 3D Glass Solutions will build an advanced packaging facility with technologies such as glass interposers and 3D heterogeneous integration (3DHI). In Punjab, Continental Device India Ltd (CDIL) will expand discrete semiconductor production with devices like MOSFETs, IGBTs and Schottky diodes, critical for EVs, renewable energy and telecom.
Jobs and ecosystem development
ELCINA expects the four projects to generate over 2,000 direct and multiple indirect jobs. But the body stressed that employment is just one part of the story. “The Cabinet’s decision will accelerate the diversification and deepening of India’s semiconductor capabilities,” said Rajoo Goel, Secretary General of ELCINA. “Beyond silicon, the entry into SiC devices, advanced interposers and high-power discretes expands opportunities in EVs, defence, telecom and renewable energy. This is exactly the direction the industry has been advocating—to tap niches where India can leapfrog rather than play catch-up. By combining this with our world-class chip design base and the government’s sustained investment in skills, we are creating an ecosystem that will be globally competitive.”
Goel further emphasised the importance of talent development to gain maximum benefit from the development. “Already over 60,000 students have been trained under ISM’s talent programmes, and we expect this number to grow rapidly, as these projects are near commissioning. Without the human capital, infrastructure alone cannot deliver results. ELCINA’s role will be to ensure that the skills pipeline, policy stability and industry partnerships align to make these projects succeed over the long term.”
ELCINA noted that the approvals are directly linked to India’s stated target of $500 billion in electronics production by 2030. By bringing in compound semiconductors and advanced packaging, India is carving out specialised niches in the global supply chain, rather than competing head-on with entrenched silicon fabs in Taiwan and Korea. “These projects are transformative not just for the companies or the states involved, but for India’s global positioning,” Goel said, emphasising that if executed well, they will send a strong signal to the world that India is ready to move from being a design powerhouse to becoming a serious manufacturing hub.
Notably, with an investment outlay of nearly Rs 4,600 crore, the projects span Odisha, Punjab, and Andhra Pradesh, bringing India into advanced domains such as silicon carbide (SiC) semiconductors, high-power discrete devices, and advanced glass substrate packaging.
“These approvals represent a giant leap forward in India’s semiconductor journey,” said Sasikumar Gendham, President of ELCINA. “For the first time, we will see commercial production of compound semiconductors and advanced glass substrate packaging on Indian soil, reducing critical import dependencies. This will not only ease pressure on our electronics trade balance but also provide the backbone for strategic sectors like defence, EVs and renewable energy.”
“With India now investing in technologies that go beyond conventional silicon, we are positioning ourselves not just as participants but as potential leaders in high-growth markets such as EV charging and high-performance computing,” he said.
Gendham further stated that ELCINA looks at the approvals as part of a longer cycle of transformation. “The combination of cutting-edge technologies and strong domestic manufacturing will position India as a serious contender in the global semiconductor market. These projects also show that the government is listening to industry feedback and diversifying focus instead of chasing only the traditional silicon fab model. ELCINA will actively support their execution, facilitate industry-academia linkages, and ensure they are seamlessly integrated into our broader electronics ecosystem,” he added.
State-level strategic impact
In Andhra Pradesh, ASIP Technologies, backed by South Korea’s APACT Co. Ltd, will set up a system-in-package (SiP) unit aimed at mobile, automotive and consumer electronics. Odisha is expected to emerge as a hotspot for next-generation semiconductor technologies. SiCSem Pvt. Ltd, in collaboration with the UK’s Clas-SiC Wafer Fab, will establish India’s first SiC fab with an annual capacity of 60,000 wafers and 96 million packaged units. Additionally, US-based 3D Glass Solutions will build an advanced packaging facility with technologies such as glass interposers and 3D heterogeneous integration (3DHI). In Punjab, Continental Device India Ltd (CDIL) will expand discrete semiconductor production with devices like MOSFETs, IGBTs and Schottky diodes, critical for EVs, renewable energy and telecom.
Jobs and ecosystem development
ELCINA expects the four projects to generate over 2,000 direct and multiple indirect jobs. But the body stressed that employment is just one part of the story. “The Cabinet’s decision will accelerate the diversification and deepening of India’s semiconductor capabilities,” said Rajoo Goel, Secretary General of ELCINA. “Beyond silicon, the entry into SiC devices, advanced interposers and high-power discretes expands opportunities in EVs, defence, telecom and renewable energy. This is exactly the direction the industry has been advocating—to tap niches where India can leapfrog rather than play catch-up. By combining this with our world-class chip design base and the government’s sustained investment in skills, we are creating an ecosystem that will be globally competitive.”
Goel further emphasised the importance of talent development to gain maximum benefit from the development. “Already over 60,000 students have been trained under ISM’s talent programmes, and we expect this number to grow rapidly, as these projects are near commissioning. Without the human capital, infrastructure alone cannot deliver results. ELCINA’s role will be to ensure that the skills pipeline, policy stability and industry partnerships align to make these projects succeed over the long term.”
ELCINA noted that the approvals are directly linked to India’s stated target of $500 billion in electronics production by 2030. By bringing in compound semiconductors and advanced packaging, India is carving out specialised niches in the global supply chain, rather than competing head-on with entrenched silicon fabs in Taiwan and Korea. “These projects are transformative not just for the companies or the states involved, but for India’s global positioning,” Goel said, emphasising that if executed well, they will send a strong signal to the world that India is ready to move from being a design powerhouse to becoming a serious manufacturing hub.
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